英特尔与蓝思科技合作，为AI时代赋能先进半导体封装

此次合作将英特尔的先进封装专业知识与蓝思科技的精密玻璃加工能力相结合，旨在为未来的AI和数据中心工作负载提供更卓越的性能。

SANTA CLARA, Calif. & CHANGSHA, China — Intel Corporation and Lens Technology today announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging. Through this work, the companies intend to explore opportunities to accelerate the development of glass substrate-based packaging solutions that can help enable higher performance, increased interconnect density, and improved power efficiency for future computing platforms. Intel and Lens Technology will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.

“Advanced packaging is becoming a critical driver of semiconductor innovation as AI systems continue to push the boundaries of performance, scale, and efficiency," said Lip-Bu Tan, CEO of Intel. “Intel brings deep expertise in semiconductor architecture and advanced packaging technologies, while Lens Technology contributes world-class capabilities in precision glass processing, laser manufacturing, and large-scale production. Together, we have an opportunity to explore new approaches to advanced packaging that can help unlock the next generation of system-level innovation for the AI era.” 

 “Lens Technology has built its leadership on advanced materials engineering and precision manufacturing, serving some of the world's most demanding technology companies,” said June Chau, founder and chairwoman of Lens Technology. “By combining Lens Technology's expertise in glass materials, high-precision laser processing, and advanced manufacturing with Intel's leadership in semiconductor design and packaging, we believe we can help accelerate innovation in advanced packaging technologies. This collaboration will support the rapid development of next-generation computing solutions and AI infrastructure for customers around the world.” 

Through this collaboration, Intel and Lens Technology will explore potential areas of cooperation in critical manufacturing processes to scale the adoption of advanced semiconductor packaging. Intel and Lens Technology also see meaningful opportunities to collaborate in additional areas where their capabilities may complement one another. Potential areas of future interest include components for AI PCs, high-reliability structural and thermal solutions for data center servers, and hardware platforms supporting AI robotics, intelligent industrial equipment, and edge computing.  

内容翻译：

加州圣克拉拉与中国长沙 — 英特尔公司与蓝思科技宣布达成一项战略合作，重点致力于赋能先进半导体封装的新技术。通过此次合作，双方计划探索相关机遇以加速基于玻璃基板的封装解决方案的开发，从而帮助未来的计算平台实现更高的性能、更大的互连密度以及更优的能效。

英特尔和蓝思科技将利用各自在先进半导体封装、精密制造、玻璃基板研发及工艺创新方面的优势，以支持AI、数据中心和专用计算应用不断增长的需求。

英特尔CEO 陈立武表示：“随着AI系统不断突破性能、规模和效率的边界，先进封装正成为半导体创新的关键驱动力。英特尔在半导体架构和先进封装技术方面拥有深厚的专业知识，而蓝思科技则在精密玻璃加工、激光制造和大规模生产方面贡献了世界级的能力。携手合作，我们将有机会探索先进封装的新途径，帮助开启AI时代下一代系统级创新。”

蓝思科技创始人兼董事长周群飞表示：“蓝思科技凭借在先进材料工程和精密制造领域的优势确立了领导地位，服务于全球要求最严苛的一些科技公司。通过将蓝思科技在玻璃材料、高精度激光加工和先进制造方面的专长与英特尔在半导体设计和封装领域的领导地位相结合，我们相信可以帮助加速先进封装技术的创新。此次合作将支持面向全球客户的下一代计算解决方案和AI基础设施的快速发展。”

通过此次合作，英特尔和蓝思科技将探索关键制造工艺中的潜在合作领域，以扩大先进半导体封装的规模化应用。英特尔和蓝思科技还认为，在其他双方能力可互补的领域也存在开展合作的重要机遇。未来潜在的合作领域包括 AI PC 组件、用于数据中心服务器的高可靠性结构与散热解决方案，以及支持 AI 机器人、智能工业设备和边缘计算的硬件平台。