2027 China International Semiconductor and Integrated Circuit Industry Exhibition

2027 China International Semiconductor and Integrated Circuit Industry Exhibition

1、 Exhibition Background

The semiconductor and integrated circuit industry is the core cornerstone of the digital information industry, a strategic core industry that empowers artificial intelligence, high-end manufacturing, and the iteration and upgrading of new generation information technology. It is related to national industrial security and independent and controllable technology. Driven by new quality productivity, China's semiconductor industry is currently in a critical window period of independent breakthroughs, system restructuring, and large-scale substitution. The country continues to introduce policies to support research and development, focusing on key areas such as core equipment, critical materials, core chips, industrial software, etc., to promote the integration of the circuit industry chain to make up for shortcomings, strengths and weaknesses, and optimize the ecosystem.

AI computing, new energy vehicles, aerospace, industrial Internet and other emerging fields are booming, and continue to drive market demand for high-end chips, power semiconductors, third-generation semiconductors and other products. The scale of domestic industries is steadily growing, and domestic substitution continues to accelerate. However, bottlenecks in high-end equipment and materials, technological barriers, poor connection between industry, academia, research and application, and difficulties in supply and demand matching still need to be solved urgently. It is urgent for national platforms to connect the industrial chain, supply chain, innovation chain, and capital chain, and accelerate the industrialization of innovative achievements.

In this context, the 2027 China International Semiconductor and Integrated Circuit Industry Exhibition will be held from June 24th to 26th, 2027 at the Shougang Convention and Exhibition Center in Beijing, along with the Artificial Intelligence and Embodied Robot Innovation Conference. The organizing committee invites the world in both Chinese and English, leveraging the advantages of Beijing's scientific and technological resources to create a domestic and global platform for semiconductor industry exchange and cooperation, covering the entire semiconductor industry chain. It integrates multiple functions such as display and release, academic exchange, supply and demand matching, achievement transformation, and capital docking, bringing together leading enterprises, specialized and innovative enterprises, research institutes, application ends, and investment institutions to promote collaborative innovation in the industry.

2、 Organizational structure

Organizer

Beijing Zhongsheng International Exhibition Co., Ltd

Semiconductor Enterprise Innovation Alliance

Integrated Circuit Industry Innovation and Development Center

Organizer

Beijing Zhongsheng International Exhibition Co., Ltd

3、 Exhibition theme

New Quality Drive · Core Chain Collaboration

四、Exhibition scope

 (1) Semiconductor core production equipment: wafer manufacturing equipment (lithography machine, etching machine, thin film deposition equipment PVD/CVD/ALD, ion implantation machine, wafer cleaning equipment, oxidation diffusion equipment, coating and development equipment, annealing equipment, CMP polishing equipment, wafer thinning equipment); Packaging process equipment (wafer cutting machine, solidification machine, bonding machine, ball planting machine, plastic packaging machine, rib cutting and forming equipment, laser marking machine, packaging and bonding, vacuum packaging equipment); Testing and measurement equipment (wafer testing machine, finished product testing machine, probe station, testing sorting machine, AOI optical inspection, electron beam inspection, film thickness testing, flatness testing, defect detection, reliability testing equipment); Auxiliary supporting equipment (semiconductor automation transmission, vacuum equipment, ultra clean equipment, precision machining, temperature control and dehumidification equipment, intelligent manufacturing production line equipment).

(2) Semiconductor key raw materials and auxiliary materials: substrate substrates (8/12/18 inch silicon wafers, silicon carbide SiC, gallium nitride GaN, sapphire, gallium arsenide, indium phosphide, germanium wafers and various compound semiconductors, special insulation substrates); Process materials (photoresist and supporting reagents, special electronic gases, high-purity target materials, polishing solution/polishing pad, wet electronic chemicals, developing solution, stripping solution, etching solution, high-purity reagents, dielectric materials, insulation slurry); Packaging supporting materials (epoxy resin, conductive adhesive, solder balls, lead frame, carrier tape, protective film, packaging filler); Functional auxiliary materials (chip heat dissipation and thermal conductivity materials, electromagnetic shielding materials, anti-oxidation materials, precision films, semiconductor specific consumables).

 (3) EDA software, semiconductor IP, and chip design services: EDA full process tools (chip architecture design, circuit simulation, logic synthesis, layout design, physical verification, timing analysis, testing and verification software, domestic full process EDA solutions); Semiconductor IP cores (processor IP, GPU/AI IP, interface IP, RF IP, power management IP, storage IP, automotive grade IP, various software and hardware core IP authorization and customization services); Chip design customization services (chip architecture development, front-end design, back-end layout and wiring, chip redesign and optimization, customized development, chip mounting solutions, industry university research design cooperation).

 (4) Wafer manufacturing, advanced processes, and foundry services: wafer foundry production (5nm/7nm/14nm advanced processes, 28nm/40nm/90nm mature processes, power device, analog, high-voltage, RF specific specialty process foundry); Wafer products and processing services (polishing wafers, epitaxial wafers, ultra-thin wafers, structured customized wafers, wafer coating, modification, annealing, repair, cutting and outsourcing, and other process processing services).

 (5) Advanced Packaging Testing and Certification: Advanced Packaging Technologies and Products (DIP, SOP, SOT, QFP Traditional Packaging); BGA, CSP, FC, WLCSP, TSV, SiP, 2.5D/3D stacking, Chiplet chip advanced packaging; Vehicle standard high reliability packaging, micro high-density packaging, power module packaging); Testing and inspection services (wafer testing, finished electrical testing, high and low temperature environment testing, aging testing, withstand voltage testing, reliability life testing, EMC electromagnetic compatibility testing); Certification analysis services (AEC-Q100 automotive certification, industrial/military/aerospace reliability certification, chip failure analysis, yield optimization, third-party quality inspection certification services).

 (6) Core semiconductor devices and chip products: general logic and main control chips (CPU, MCU, MPU, FPGA/CPLD, logic devices, DRAM/Flash/ROM storage chips); Computing power and high-end specialized chips (AI training/inference chips GPU、NPU、 Edge computing chip, server specific chip, AI computing module); Simulation and power chip (LDO, DC-DC, PMIC power management chip, operational amplifier, comparator, voltage regulator chip, charging management chip); RF and communication chips (RF transceiver, Bluetooth, WiFi, 5G/6G communication, signal amplification, filtering, antenna driver chips); Power semiconductor devices (MOSFET, IGBT, thyristor, fast recovery diode, high and low voltage power devices, SiC/GaN third-generation semiconductor devices, high-frequency/vehicle/energy storage power modules); Featured specialty semiconductors (MEMS sensors, optoelectronic devices, laser/infrared chips, high reliability specialty integrated circuits for military, aerospace, industrial control, etc.).

 (7) Terminal application scenario solution: artificial intelligence and computing power terminals (AI servers, computing power modules, edge intelligent devices, AI terminal chip application solutions); Automotive Electronics and Intelligent Driving (Vehicle Control System, Vehicle Perception Chip, Autonomous Driving Domain Controller, Vehicle Power Supply, Vehicle Power Devices, Vehicle Electronic Solutions); Industrial and high-end manufacturing (industrial control chips, servo drive modules, industrial sensors, intelligent manufacturing accessories, robot control chips and power modules); High end specialized fields (aerospace, rail transportation, military equipment, energy storage, photovoltaic and wind power supporting semiconductor devices and solutions); Consumer and Livelihood Electronics (Smart Home, Wearable Devices, Consumer Electronics, IoT Terminal Supporting Chips and Devices).

(8) Comprehensive industrial supporting services: chip research and development outsourcing, technology achievement transformation, industry university research docking, intellectual property services, industrial investment and financing, supply chain trade, warehousing and logistics, talent training, industry consulting, media platform, intelligent manufacturing digital solutions, and full industry chain supporting system services.

五、Concurrent Events

（一）Academic Forum

(1) Forum on Localization of Semiconductor Equipment and Key Materials

 (2) Gathering independent innovation and building a safe and controllable integrated circuit industry ecosystem summit forum

(3) Precision Supply and Demand Matching Conference for the Whole Integrated Circuit Industry Chain

（二）Signing Ceremony for Industrial Chain Projects

During the exhibition, participating companies, industrial parks, terminal purchasers, and investment institutions will hold industry chain cooperation, production line landing, investment and financing, and bulk procurement signing ceremonies, inviting industry leaders, executives of listed companies, and industry media to witness on-site.

（三）New Technology and New Product Launch Event

Open to professional purchasers, R&D engineers, and park investment managers nationwide, enterprises release new generation equipment, materials, and chip products, while simultaneously conducting technical presentations, sample displays, on-site negotiations, and media coverage throughout the process.

（四）Honor Awards Ceremony

The organizing committee selects and awards the "Semiconductor Technology Innovation Enterprise Award" and "Annual Excellent Integrated Circuit Enterprise Integrity Award" to encourage technology innovation and coordinated development of the industry chain enterprises, promote enterprise integrity management, continuously innovate and develop, and make positive contributions to the industry.

六、Attendees

Professional audience and attendees: National and local industry regulatory departments, industrial parks, industry associations; Universities and research institutes; Chip design, wafer manufacturing, packaging testing, semiconductor equipment, critical materials, EDA/IP service providers; AI computing power, new energy vehicles, energy storage photovoltaics, industrial control, aerospace, and IoT terminal application enterprises; Investment institutions, domestic and foreign trade agents, technology research and development, quality certification, and procurement engineers, etc.

七、Exhibition Hall Introduction

This exhibition is held at the Shougang Convention and Exhibition Center in Beijing, located in the core area of the Beijing West Science and Technology Innovation Corridor. It is a national level science and technology innovation exhibition highland that Beijing is focusing on building, and also the core venue for national heavyweight exhibitions. It has a high industry reputation and authoritative credibility, and is a benchmark venue for domestic integrated circuit, semiconductor, and high-end equipment technology exhibitions.

The venue is upgraded based on a century old industrial heritage, integrating modern international exhibition hardware standards. The exhibition space is well-organized and spacious, with smooth flow and superior load-bearing capacity. It is fully suitable for the layout, lifting, and exhibition needs of semiconductor large-scale equipment, precision chip devices, and advanced process equipment. The venue is equipped with a thousand person lecture hall, a multifunctional conference center, and an exclusive VIP negotiation area, which can simultaneously host a series of industrial activities such as high-end forums, technology releases, supply and demand docking, and investment and financing salons.

The park focuses on cutting-edge tracks such as integrated circuits, artificial intelligence, and high-end manufacturing, with a high concentration of science and technology innovation industries and a pure industry atmosphere. Relying on the core resource advantages of the capital, it can accurately gather high-end customers such as government and enterprise experts, industry experts, terminal procurement, and industrial capital, and create a high standard, high precision, and high conversion full industry chain business cooperation platform for the exhibition.

八、Group visits and group services

The organizing committee opens up group visit channels for industrial parks, industry associations, research institutes, large enterprise groups, and terminal application units from all over the country. Groups can enjoy free green channel fast entry, customized tour routes, precise supply-demand matching, forum priority seats, exhibition material packages, and large groups can book exclusive negotiation spaces. For group visits (with a minimum of 5 people), please contact the person in charge of the exhibiting group through the official website to complete the relevant procedures.

九、 Booth Fee Standards

（一） Standard booth: (3mx3m=9m ²).

(1) Domestic enterprises: Standard booth: 16800 yuan/9m ², double-sided booth: 17800 yuan, boutique booth: 18800 yuan/9m ², double-sided booth: 19800 yuan,

 (2) Overseas enterprises: Standard booth: 21800 yuan/9m ², double-sided booth: 22800 yuan, boutique booth: 25800 yuan/9m ², double-sided booth: 26800 yuan.

 (3) Light land: 1580 yuan/m ²; Light land (minimum rent of 36 square meters).

(4) Note: The standard booth includes two or three display boards, negotiation tables and chairs, two spotlights, 220V/5A power sockets, carpet, and company name fascia board. Guangdi: There are no facilities, exhibitors can entrust the organizer to designate a construction contractor to coordinate the design, and bear the cost of production and construction at their own expense,

(5) Booking bare space: The bare space booth has no facilities. Exhibitors can entrust the organizer to designate a construction contractor to coordinate the design, and bear the cost of production, construction, and construction at their own expense.

（2） Exhibition related advertising: Please contact the organizing committee for conference reports, technical exchanges, publication promotion, advertising sponsorship, on-site event sponsorship, and other forms of promotion.

十、 Forum Fee Standards

 (1) Domestic enterprises: Giving a speech at the forum costs 30000 yuan/15 minutes. If you need to extend the time, please apply in advance. Note: Accommodation and transportation are at your own expense.

(2) Foreign companies: Forum speech costs 50000 yuan per person for a 15 minute speech. If you need to extend the time, please apply in advance (note: accommodation and transportation are at your own expense).

 (3) Exhibition consultation: Request the participation application form, fill it out carefully, and submit it to the organizing committee for confirmation.

十一、 Exhibition procedures and services

 (1) The booth will be registered first, paid first, and arranged first.

 (2) After filling out the exhibition application form and stamping it, scan or mail it to the exhibition organizing committee.

十二、Contact information of the organizing committee

Contact: Xie Shuhan

mobile phone：132 3378 6525

Email:13233786525@163.com

official account：GAAMEXPO

official website：www.wldrobotexpo.cn